december 2006 hyb18l512160bf-7.5 hye18l512160bf-7.5 drams for mobile applications 512-mbit mobile-ram rohs compliant data sheet rev. 1.22
we listen to your comments any information within this document that yo u feel is wrong, unclear or missing at all? your feedback will help us to continuous ly improve the quality of this document. please send your proposal (including a reference to this document) to: techdoc@qimonda.com data sheet. hy[b/e]18l512160bf-7.5 512-mbit mobile-ram qag_techdoc_rev400 / 3.2 qag / 2006-08-07 2 01132005-06iu-igvm hyb18l512160bf-7.5, hye18l512160bf-7.5 revision history: 2006-12, rev. 1.22 page subjects (major changes since last revision) all qimonda update previous version: 2005-11, rev. 1.11 51 idd7 change from 20 to 25 54 updated the package drawing. previous revision: rev. 1.1 50 table 20: delete note 6 change note 6 from (tt -1 ) to [0.5 x (tt -1)] . 51 - idd4: change from 60 to 90 - idd7: change from 40 to 20 - add a note: value shown is typical 54 - updated the package drawing. all - package name: change from p-tfbga to pg-tfbga - remove all references to hyb18l512160bc-7.5 and hye18l512160bc-7.5 previous version: rev. 1.0
data sheet. rev. 1.22, 2006-12 3 01132005-06iu-igvm hy[b/e]18l512160bf-7.5 512-mbit mobile-ram 1overview 1.1 features ? 4 banks 8 mbit 16 organization ? fully synchronous to positive clock edge ? four internal banks for concurrent operation ? programmable cas latency: 2, 3 ? programmable burst length: 1, 2, 4, 8 or full page ? programmable wrap sequence: sequential or interleaved ? programmable drive strength ? auto refresh and self refresh modes ? 8192 refresh cycles / 64 ms ? auto precharge ? commercial (0 c to +70 c) and extended (-25 c to +85 c) operating temperature range ? dual-die 54-ball pg-tfbga package (12.0 8.0 1.2 mm) ? rohs compliant products 1) power saving features ? low supply voltages: v dd = 1.70 v to 1.95 v, v ddq = 1.70 v to 1.95 v ? optimized self refresh ( i dd6 ) and standby currents ( i dd2 / i dd3 ) ? programmable partial array self refresh (pasr) ? temperature compensated self-refresh (tcs r), controlled by on-chip temperature sensor ? power-down and deep power down modes table 1 performance 1) rohs compliant product: restriction of the use of certain hazar dous substances (rohs) in el ectrical and electronic equipment as defined in the directive 2002/95/ec issued by the european parliament and of the council of 27 january 2003. these substances include m ercury, lead, cadmium, hexavalent chromium, polybro minated biphenyls and polybrominated biphenyl ethers. part number speed code - 7.5 unit speed grade 133 mhz access time ( t acmax ) cl = 3 6.0 ns cl = 2 7.0 ns clock cycle time ( t ckmin ) cl = 3 7.5 ns cl = 2 9.5 ns
data sheet. rev. 1.22, 2006-12 4 01132005-06iu-igvm hy[b/e]18l512160bf-7.5 512-mbit mobile-ram table 2 memory addressing scheme table 3 ordering information item addresses banks ba0, ba1 rows a0 - a12 columns a0 - a9 type 1) 1) hy[b/e]: designator for memory products (hyb: standard temp range, hye: extended temp. range) 18l: 1.8 v mobile-ram 512: 512 mbit density 160: 16 bit interface width b: die revision f: green product -7.5: speed grade(s): min. clock cycle time package description standard temperature range hyb18l512160bf-7.5 pg-tfbga-54 133 mhz 4 banks 8 mbit 16 lp-sdram extended temperature range hye18l512160bf-7.5 pg-tfbga-54 133 mhz 4 banks 8 mbit 16 lp-sdram
data sheet. rev. 1.22, 2006-12 5 01132005-06iu-igvm hy[b/e]18l512160bf-7.5 512-mbit mobile-ram 1.2 pin configuration figure 1 standard ballout 512-mbit mobile-ram 1.3 description the hy[b/e]18l512160bf is a high-speed cmos, dynamic random-access memory contai ning 536,870,912 bits. it is internally configured as a quad-bank dram. the hy[b/e]18l512160bf achieves high speed data transfer rates by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to the system clo ck. read and write accesses are bu rst-oriented. accesses start at a selected location and continue for a programmed number of lo cations (1, 2, 4, 8 or full page) in a programmed sequence. the device operation is fully synchronous: all inpu ts are registered at the positive edge of clk. the hy[b/e]18l512160bf is specially designed for mobile ap plications. it operates from a 1.8 v power supply. power consumption in self refresh mode is dras tically reduced by an on-chip temperature sensor (octs); it can further be reduced by using the programmable part ial array self refresh (pasr). a conventional data-retaining power down (pd) mode is avai lable as well as a non-data-retaining deep power down (dpd) mode. the hy[b/e]18l512160bf is housed in a dual-die 54-ball pg-tfbga package. it is available in commercial (0 c to +70 c) and extended (-25 c to +85 c) temperature ranges. 6 3 3 1 5 $ 1 - 6 $ $ 1 $ 1 $ 1 $ 1 6 3 3 1 6 $ $ 1 # + % # , + ! ! ! ! $ 1 $ 1 $ 1 6 3 3 " ! $ 1 $ 1 $ 1 6 $ $ , $ 1 - $ 1 6 3 3 1 6 $ $ 1 6 3 3 1 " ! ! ! ! 0 6 $ $ 6 $ $ 1 $ 1 $ 1 $ 1 $ 1 ! " # $ & |